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3oz Copper Multilayer PCBs

Product Details

3oz Copper Multilayer PCBs Manufacturers
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3oz Copper Multilayer PCBs for Various Applications

Model Number: M-605

 
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Country of Origin:
  • Taiwan
Primary Competitive Advantages:
  • Product Performance
  • Prompt Delivery
  • Quality Approvals
  • Competitive price
Main Export Markets:
  • Eastern Europe
  • North America
  • Mid East/Africa
  • Central/South America
  • Asia
  • Western Europe
  • Australasia
 
Key Specifications/Special Features:
  • Multi-layer (4 to 12) layers high density various material PCBs
  • Material: FR-4, 0.5oz - 3oz copper, 0.45 to 3.2mm thickness
  • Minimum line width and line spacing: 4mm/4mm
  • Minimum hole diameter: 0.2mm
  • Maximum panel size: 480 x 580mm
  • Surface finishing:
    • HAL, Alpha Level, gold plating, ENTech
    • HAL or tin and gold plating
  • Solder mask type: liquid photo imageable soldermark.
  • Precision V-cut or ruting for panel form design
  • OEM orders for SMT and A/I assembly projects accepted
  • Gerber file preferred
  • Please note the following information are for your reference on our manufacturing capability, not for inquiries on quotes
  • We will offer our best prices if you can send your us own PCB design
Payment Details:
  • Payment Terms:
    • T/T, irrevocable L/C
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More Information  
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High-density PCB has four to 12 layers
Contact Details  

BCP Technologies Inc
7F-2, No. 181
Fu Hsing N. Road
Sung San
Taipei
Taiwan 105
Tel:  (886 2) 87705128
Fax:  (886 2) 87705133
E-mail:
Homepage Address
http://www.globalsources.com/bcp.co


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Key Contact:
Mr  Wang,  Jim

Supplier and product information updated March 01, 2012.
Verified Business Registration Details
Registered Company: 松涵企業有限公司
Business Registration Number: 86133459
Company Registration Address: 臺北市松山區復興北路181號7樓之2
* In some jurisdictions, company names and addresses are registered in Chinese only.
This supplier has been verified by Global Sources. Our verification process includes 3 on-site visits, financial checks and more...
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